廣東新巨電子科技有限公司是一家集開(kāi)發(fā)、研制和銷(xiāo)售于一體的現代化電子高新科技企業(yè)。公司組建于2004年,在新型片式元器件和電子材料領(lǐng)域方面具備先進(jìn)的設計制造技術(shù)和豐富的應用經(jīng)驗,并秉承著(zhù)“為客戶(hù)需求提供良好解決方案”的經(jīng)營(yíng)理念。

新巨電子主要設計開(kāi)發(fā)、生產(chǎn)和銷(xiāo)售現代電子元器件及其電子材料,在陶瓷電容器瓷料、陶瓷基片、陶瓷薄膜金屬化、陶瓷薄膜電路等領(lǐng)域不斷研究和開(kāi)發(fā)產(chǎn)品,主要產(chǎn)品有多層片式陶瓷電容器、多層片式陶瓷壓敏電阻器等傳統電子元器件及微電子電路新產(chǎn)品:微波單層電容器、陶瓷薄膜電路、鍵合型薄膜電阻、陶瓷墊片(陶瓷熱沉片)及其他客戶(hù)定制薄膜產(chǎn)品。產(chǎn)品廣泛用于新一代環(huán)保節能照明燈具、5G通信設備及終端、模擬或數字調制解調器、局域網(wǎng)/廣域網(wǎng)接口/濾波器、汽車(chē)電子及醫療等電子產(chǎn)品中;其中微電子電路產(chǎn)品專(zhuān)注于為微波、毫米微波領(lǐng)域和光通信、LED等領(lǐng)域企業(yè)提供良好產(chǎn)品。

公司設計開(kāi)發(fā)技術(shù)力量雄厚,擁有整套成熟設計開(kāi)發(fā)體系,與美國、日本、韓國和臺灣地區等現代電子材料與元器件的設計或制造公司及國內著(zhù)名高校有著(zhù)多年的合作,以先進(jìn)設計和產(chǎn)品服務(wù)于國內電子信息產(chǎn)業(yè)。公司建立完善的質(zhì)量管理體系,所有產(chǎn)品符合環(huán)保要求,并通過(guò)不斷加強質(zhì)量管理工作和技術(shù)創(chuàng )新,持續改進(jìn)和提升公司的質(zhì)量管理水平

Guangdong Sanjv Electronics Co., Ltd. is a modern electronic high-tech enterprise integrating development, development and sales. Company founded in 2004, the new chip components and electronic materials area with the application of advanced design and manufacturing technology and rich experience, and adhering to the "provide the best solution for the customer demand" business philosophy.

SANJV Electronics main design, development, production and sales of modern electronic components and electronic materials, in ceramic capacitor porcelain, ceramic substrate, ceramic metal membrane and ceramic membrane circuit in areas such as research and development products, the main products are multilayer chip ceramic capacitors, chip ceramic piezoresistor traditional electronic and microelectronic circuit of new products such as: microwave single capacitor, ceramic thin film circuit, bonding type thin film resistors, ceramic gasket (ceramic heat sink) and other customized film products. Company products are widely used in patch element of a new generation of environmental protection and energy saving lighting lamps and lanterns, 5G communications equipment and terminals, analog or digital modem, LAN/wan interface/filter, automotive electronics, and high-end medical electronic products; Microelectronic circuit products focus on providing quality products for the microwave, millimeter microwave and optical communication and LED industries.

Company designs, develops and strong technical force, has a complete set of mature design development system, and the United States, Japan, South Korea and Taiwan area and other modern electronic materials and components of the design or manufacturing company with many years of cooperation, with advanced design and products and services to domestic electronic information industry. The company establishes a perfect quality management system, all products conform to Rohs standards, and continuously improve and improve the quality management level of the company through the continuous improvement of quality management work and technical innovation.

我們的實(shí)力  SANJV  CAPABLILITY

陶瓷材料制造能力  Ceramic material 

高Q低損耗材料 High Q, low  DF  material:

◇ 介電常數Dielectric constant: 20~100

◇ 介質(zhì)損耗Dielectric loss factor: 0 . 5×10-4~15×10-4

◇ 工作溫度范圍Operating temperature: -55℃~+125℃

◇ 溫度系數Temperature coefficient: ≤30ppm/℃


溫度補償型材料Temperature Compensation Materials:

◇ 介電常數 Dielectric constant: 130~900 

◇ 介質(zhì)損耗 Di electric loss factor: 5 ×10-4~150×10-4

◇ 工作溫度范圍 Operating temperature:  -55℃~+125℃

◇ 溫度系數Temperature coefficient: 750ppm/℃~-3300ppm/℃


X7R介質(zhì)材料  EIA  Standard  X7R  materials

◇ 介電常數Dielectric constant: 2000~4500:

◇ 介質(zhì)損耗 Dielectric loss factor: 150×10-4~350×10-4

◇ 工作溫度范圍 Operating temperature: -55℃~+125℃            

◇ 溫度變化率 Rate of temperature change:  ≤ 15%  


晶界層高介電常數材料 Grain  boundary  barrier  layer  materials:

◇ 介電常數 Dielectric const ant:  15000~45000

◇ 介質(zhì)損耗 Dielectric loss factor:  200×10-4~400×10-4

◇ 工作溫度范圍 Operating temperature:  -55℃~+125℃

◇ 溫度變化率 Rate of temperature change:  ≤15%


陶瓷基片制造能力 Ceramic substrates        

流延工藝生產(chǎn) Tape casting process       

最小厚度  Min thickness: 0. 1mm    

最大尺寸 Max dimension: 50. 8mm×50. 8mm

最小粗糙度 Min roughness: Ra≤0. 1um      

陶瓷金屬薄膜化能力 Ceramic thin film metallization 

全自動(dòng)磁控濺射  Auto magnetron sputtering system

集成金屬導帶膜、電阻膜  Conductor, resistor film integated  

干法濕法圖形化技術(shù)  Dry and wet etching technology  

最細線(xiàn)條 Min line width: 10um 

方阻范圍 Sheet resistance: 1 0~300                

陶瓷切割能力Ceramic cutting 

全自動(dòng)化切割  Automatic dicing machine

自動(dòng)刀體補償  Automatic cutter compensation

陶瓷開(kāi)槽能力  Slot on ceramic